Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on 

 - New York, USA  IEEE (Institute of Electrical and Electronics Engineers) 
 - On-campus e-Journal under Digital Library Program of Higher Education Commission (HEC) of Pakistan 
<br/><br/><label>ISSN: </label>1083-4400 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Components, Packaging, - Manufacturing Technology, Part C, IEEE Transactions on