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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Material type: TextTextPublication details: New York, USA; IEEE (Institute of Electrical and Electronics Engineers)Description: On-campus e-Journal under Digital Library Program of Higher Education Commission (HEC) of PakistanISSN:
  • 1070-9894
Subject(s): Online resources:
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Item type Current library Call number Status Date due Barcode
e-Journal e-Journal ICCBS Digital Library Not for loan